Corporate History

Corporate History

Aug 1951
Established Gold and Silver Plating Laboratory in Mitaka city,Tokyo.
Oct 1952
Moved the laboratory to Kodaira-town (Kodaira-city at present).
Nov 1956
Reorganized the laboratory into limited private company Nishihara Surface Process Factory, and started the quantity production of transistor and other semiconductor parts.
Mar 1960
Reorganized it into stock company, and set up the Kodaira factory and expanded the facility.
Apr 1961
Separated the Print Wire Department into independent organization to establish Toyo Print Wire Corp.
Jun 1963
Separated the Equipment Section of Technical Department into Toyo Kakohki Corp.
Apr 1965
Invented the SAB plating (bright solder electroplating) and developed the new fields in semiconductor, electronic part and plating on printed-wiring board.
Jan 1966
Established the Kohfu Factory in Kohfu city and started the quantity production of both diode plating which mainly with SAB plating and mark printing.
Mar 1969
Changed the company name to Nishihara Rikoh Corp. and newly established Sayama Factory in Iruma city Saitama prefecture.
Accomplished the automated quantity production for semiconductor and electronic parts.
Oct 1977
Made the Development Section of Technological Department independent established Toyo Rikoh Laboratory.
Apr 1980
Developed the consecutive spot plating device for IC Lead Frame.
Jun 1984
Newly established the Saga Factory and started the quantity production for IC Lead Frame.
May 1985
Established the high precision stripe plating technology(STP) for hoop material.
May 1988
Newly established and moved head quarter factory and the office for Nishihara Rikoh Corp. and Toyo Print Wire in Musashimurayama-city, Tokyo.
May 1991
United Toyo Rikoh Laboratory Corp. and Toyo Kakohki Corp. to establish NR Engineering Corp.
Mar 1996
Developed the new cement Tin plating for environmental measure against lead pollution.
Aug 1996
Established the NR-C Plating (M) SND. BHD in Malaysia.
Oct 1997
Acquired authorized ISO9002 for Head Office and Sayama Factory.
Sep 1998
Started the quantity production for lead-free plating.
Oct 1998
United affiliated companies, Toyo Print Wire Corp. and NR Engineering Corp. to start the new company Nishihara Rikoh Corp.
Aug 1999
Increased the capital to JPY 38.1 mil.
Aug 2001
50th anniversary of Nishihara Rikoh Corp.
Nov 2002
Whole company authorized ISO9001.
Nov 2003
Acquired the patent (No.3492554) for TinBismuth alternative to lead.
Dec 2003
Whole company authorized ISO14001.
Sep 2006
Started the quantity production of partial gold plating toward connector.
Nov 2006
Increased the capital to JPY 76,2 mil.
Jul 2008
Chosen for "Active 300 small and medium enterprises" by Ministry of Economy.
Jul 2009
Certified "Development and commercialization of Partial Plating with high precision masking" by Kanto Bureau of Economy as the plan of new business field for coalition of different field.
Aug 2011
60th anniversary of Nishihara Rikoh Corp.
Jul 2012
Award for TPM challenge from Japan Institute of Plant Maintenance.
Jul 2012
NR-C consolidated JB factory into SA factory.